+91-9769152129

Tenders Are Invited For Silicon Austria Labs – Chips Ju: High Power Impulse Magnetron Sputtering And Inducti ... in Austria

Tender Notice
TenderID	98628277
Tender Brief	Tenders Are Invited For Silicon Austria Labs – Chips Ju: High Power Impulse Magnetron Sputtering And Inductively-Coupled Plasma Etching (Hipims & Icp)
Competition Type	ICB/NCB (Plz Refer Document)
Funded By	Self-Funded
Country	Austria
Tender Value	Plz Refer Document
Tender Value In USD	Plz Refer Document

Key Dates
Publish Date	30 Jun 2025
Last Date of Bid Submission	29 Jul 2025

CPVs
	38000000-Laboratory, optical and precision equipments (excl. glasses)

Other Detail
View Original Tender Notice / Tender Document

Work Detail
The Aim Of This Procurement Procedure Is To Award The Contract To The Best Bidder Identified During The Procurement Procedure For The Supply, Installation And Commissioning Of Two Module Chambers Capable Of High-Power Impulse Magnetron Sputtering And Inductively Coupled Plasma Surface Preparation Intended For The Fabrication Of Various Metal Thin Films, For Silicon Austria Labs Gmbh.

Contact Information
Contact No.	+4314097609
Email	kanzlei@schramm-oehler.at

View Notice Now...

Fill Detail for Getting Instant Access

Tell us about your Product / Services,
We will Find Tenders for you