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Tenders Are Invited For Supply And Installation Of Laser Lithography Equipment And Encapsulated Multi-Chip M ... in Spain

Tender Notice

TenderID 97342576
Tender Brief Tenders Are Invited For Supply And Installation Of Laser Lithography Equipment And Encapsulated Multi-Chip Modules For The Advanced Encapsulated Prototype Line, Intended For The Institute Of Microelectronics Of Seville Of The State Agency Higher Council For Scientific Research.
Competition Type ICB/NCB (Plz Refer Document)
Funded By Self-Funded
Country Spain
Tender Value EUR 1,327,590
Tender Value In USD 1,421,583

Key Dates

Publish Date 30 May 2025
Last Date of Bid Submission 30 Jun 2025

CPVs

38000000-Laboratory, optical and precision equipments (excl. glasses)
38400000-Instruments for checking physical characteristics
38500000-Checking and testing apparatus
38800000-Industrial process control equipment and remote-control equipment

Other Detail

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