Tender Notice |
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| TenderID | 105094887 |
| Tender Brief | Tenders Are Invited For Shandong Grinm Rs 12 Inch Integrated Circuit Large Silicon Wafer Industrialization Project Phase Ii Silicon Wafer Double-Sided Polishing Machine(2) |
| Competition Type | ICB/NCB (Plz Refer Document) |
| Funded By | Self-Funded |
| Country | China |
| Tender Value | Plz Refer Document |
| Tender Value In USD | Plz Refer Document |
Key Dates |
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| Publish Date | 20 Nov 2025 |
| Last Date of Bid Submission | 15 Dec 2025 |
Other Detail |
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| View Original Tender Notice / Tender Document |
