United States Project Notice - Sub-One PUE Through Silicon Cooling Efficiency


Project Notice

PNR 58665
Project Name Sub-One PUE through Silicon Cooling Efficiency
Project Detail JetCool will develop a microconvective cooling technology that combines and optimizes two distinct cooling approaches to provide the highest levels of energy efficiency in data centers. JetCool’s micro-convective cooling modules lower CPU temperatures, reducing leakage current and resulting in power savings of 8-10% while an in-server radiator eliminates the need for server-dedicated air cooling in the data center to provide significant additional energy savings.
Funded By Self-Funded
Sector Energy & Power
Country United States , Northern America
Project Value USD 1,265,719

Contact Information

Company Name JetCool Technologies
Address ARPA-E Program Director: Dr. Peter de Bock Project Contact: Dr. Ludwig Haber Press and General Inquiries Email: ARPA-E-Comms@hq.doe.gov Project Contact Email: lhaber@jetcool.com
Web Site https://arpa-e.energy.gov/technologies/projects/sub-one-pue-through-silicon-cooling-efficiency

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