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Longi has developed the Hi-MO S10, a 25% efficient rear-contact heterojunction (HJT) residential solar module, combining 27.6% efficient cells with power outputs of up to 510W and a power density of 252.3W/m². Chinese solar module manufacturer Longi has unveiled a new n-type bifacial HJT solar module based on a back-contact architecture at the Smarter-E trade fair in Munich, Germany. This is the first time that heterojunction back-contact technology has been successfully implemented in a commercialized module, the manufacturer said in a statement. The Hi-MO S10 offers a world-leading cell efficiency of 27.6% and a module efficiency of up to 25.2%, setting a new benchmark for performance in the photovoltaic industry. The Longi Hi-Mo S10 panel has a power of 490W to 510W and a power per square meter ratio of 240.1W/m² to 249.9W/m². The 54-cell module is available in five versions with power conversion efficiency ranging from 24.0% to 25.0% and a temperature coefficient of -0.24%/°C. It measures 1,800 mm × 1,134 mm × 30 mm, weighs 23.5 kg and is supported by a black anodized aluminum alloy frame, as well as semi-tempered glass with thicknesses of 2.0 mm and 1.6 mm, respectively. The new product has a 30-year linear power warranty, with a final power guarantee of no less than 88.85% of the rated output power. Module degradation is 1% during the first year, while linear degradation is 0.35% annually. Designed to last, it has a load capacity of 6000/3600 Pa, the manufacturer adds. As a result, the module can withstand very high snow loads, equivalent to 4 m of snow pressure, as well as severe storms, equivalent to a Category 15 hurricane. Its Class A fire rating guarantees the highest safety standards. The modules are manufactured using 182 mm TaiRay n-type wafers, considered a breakthrough in silicon technology. These wafers reportedly improve resistance consistency, minimize metallic impurities, and provide superior mechanical strength. “The single-contact solder structure across the entire back reduces stress on the cell edges, improving the module’s anti-crack performance. Additionally, the wafer is 10 µm thicker than conventional options, increasing its reliability and longevity,” Longi adds. “The module also incorporates bipolar passivation technology on the back that reduces the hot spot temperature by 38.75% compared to conventional TOPCon cells, significantly decreasing the likelihood of thermal events that can lead to fires.” |
