Supply Of Laser Cutting Equipment. Cea Leti Wishes To Acquire Laser Cutting Equipment Compatible With A Clean Room Process. The Equipment Must Be Capable Of Slotting, Cleaning And Cutting The Silicon Wafer. This Equipment Must Process Wafers From 50 To 300 Mm, With Or Without Frame Or Ring, And Is Intended For Cutting Semiconductor Wafers (Containing Or Not A Device). Option #1 (Optional): Cleaning Station; Option No. 2 (Optional): Heat Exchangers / Chillers; Option No. 3 (Optional): 1St Level Maintenance Training; Option No. 4 (Optional): Advanced Maintenance Training; Option No. 5 (Optional): The Price Of Transport, Insurance Included, According To The Dap Cea Grenoble Conditions (Incoterms Icc 2020 Convention)
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