Plating (Cu, Tsv, Ubm). The Object Of The Tender Is An An Electroplating Tool (Later Also “Equipment”), Which Can Electroplate Metallic Copper Films For Use As Electrically Conducting Lines And Vias Onto 150 And 200 Mm Silicon Wafers Typical Of The Semiconductor Industry. The Reference Price (The Total Price) Will Consist Of The Price For The Equipment In Required Minimum Configuration Described In Annex 1. The Optional Features Are Not Included In The Total Price Of The Equipment.The Object Of The Tender Process Is Described In More Detail In The Invitation To Tender Documents.
Contact Information
Address
P.O. Box 1000, Vtt
Contact No.
+358 20722111
Email
kilpailutus@vtt.fi
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