Si & Silicon Oxide Cmp. The Object Of The Tender Is An Automatic Chemical Mechanical Polisher (Later Also Equipment ), For The Polishing Of Typical Films And Substrates Like Si, Sicompounds, Ge And Other Typical Wafers Used In Semiconductor Industry Of 100, 150 And 200Mm Diameter. The Equipment Shall Be Designed With At Least Two Polishing Platens With Integrated Insitu Capable Pad Conditioning Systems, An Endpoint Detection On At Least One Platen, Multizone Carrier Heads For All Wafer Diameters And A Slurry Feed System For At Least 3 Slurries. In Addition, A Supporting Wafer Cleaning System Either Integrated Or Standalone Is An Optional Part Of The Tendering Procedure.The Object Of The Tender Process Is Described In More Detail In The Invitation To Tender Documents.
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