Plasma Ald. The Object Of The Tender Is A 2Chamber Plasma Enhanced Atomic Layer Deposition Cluster With Automatic Wafer Handling (Later Also Equipment And/Or Tool) For Coating Of 200Mm Wafer Substrates, Or Substrates That Can Be Placed On Such Carrier Wafers, With Different Metals, Nitrides And Oxides With Process Separation Between Metals/Nitrides And Oxides, And Wafer Handling From Chambertochamber And Chambertocassette Without Vacuum Breaking.The Object Of The Tender Process Is Described In More Detail In The Invitation To Tender Documents.
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