Procurement Plan For Tlc For 4 Packages Of Procurement Of Printed Circuits Soldering Boards Fpga Chips Mecha ...

Tender Notice

TenderID 38025589
Tender Brief Procurement Plan For Tlc For 4 Packages Of Procurement Of Printed Circuits Soldering Boards Fpga Chips Mechanical Chassis And Networking Equipment Is In Phase 2 Of The Topic
Competition Type ICB/NCB (Plz Refer Document)
Funded By Self Funded
Country Vietnam
Tender Value Plz Refer Document
Tender Value In USD 4,162,479

Key Dates

Last Date of Bid Submission 28 May 2021

Other Detail

View Original Tender Notice / Tender Document

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