Tenders Are Invited For Huatian Technology Xian Co Ltd Rf Integrated Circuit Package Expansion Scale Project ...

Tender Notice
TenderID	22348575
Tender Brief	Tenders Are Invited For Huatian Technology Xian Co Ltd Rf Integrated Circuit Package Expansion Scale Project The Third Tender
Competition Type	ICB/NCB (Plz Refer Document)
Funded By	Self Funded
Country	China
Tender Value	Plz Refer Document
Tender Value In USD	Plz Refer Document

Key Dates
Last Date of Bid Submission	24 Sep 2019

Other Detail
View Original Tender Notice / Tender Document

Get a free trial and you'll have access to BidDetail.com

Request Free Trial

Work Detail
Project Name Huatian Technology Xian Co Ltd Rf Integrated Circuit Package Expansion Scale Project The Third TenderTenders Are Invited For Automatic Printing Machine 1 Set Products List 1 Automatic Printing MachinePlace Of Implementation Shaanxi P R ChinaBeginning Of Selling Bidding Documents 2019 08 30Ending Of Selling Bidding Documents 2019 09 06Price Of Bidding Documents 800 120 120Deadline For Submitting Bids Time Of Bid Opening Beijing Time 2019 09 24 09 30

Contact Information

Other Detail

View Notice Now...

Fill Detail for Getting Instant Access

Tell us about your Product / Services,
We will Find Tenders for you