Contract Notice Industrial MachineryEdge Banding Machine With The Following Parameters Description 1 The Subject Of The Order Is The Delivery And Assembly Of The Edge Banding Machine And The Panel Storage System Together With The Panel Saw 2 The Subject Of The Proceedings Are Three Machines Edge Banding Machine Vacuum System For Handling And Storage Of Boards As Well As A Panel Saw The Scope Of The Proceedings Includes The Delivery Assembly And Commissioning Of Complete Machines In Accordance With The Requirements Specified Below Ready For Operation At The Place Of Use Of The Ordering Party The Proceedings Are Divided Into Two Parts A Part I Covers The Delivery Assembly And Start Up Of Edge Banding Machines B Part Ii Covers The Delivery Assembly And Commissioning Of The Vacuum Handling And Storage System As Well As Delivery Assembly And Commissioning Of The Panel Saw 3 A Detailed Description Of The Subject Of The Contract Part I Edge Banding Machine With The Following Parameters A The Subject Of The Proceedings Is 1 Piece Of The Said Machine B The Machine Is Brand New And Unused C Equipped With A Sheet Music Unit D The Minimum Length Of The Element No More Than 160 Mm E The Minimum Width Of The Element No More Than 60 Mm F Element Thickness No More Than 8 Mm To Not Less Than 60 Mm G Edge Thickness No More Than 0 4 Mm To Not Less Than 8 Mm H Feed Speed No More Than 10 M Min To Not Less Than 18 M Min I Adhesive Application System Enabling The Use Of Eva And Pur Glue J Automatic Lubrication Of The Conveyor Belt K Intelligent Energy Management Module L Intelligent Automation Automatic Control Of The Amount Of Glue M Spray Device At The Front And Rear Of The Release Agent N Pre Milling Aggregate O Edge Banding Kit P The Machine Should Be Safe For Use And Environment And Marked With The Ce Mark Part Ii Vacuum System For Handling And Storage Of Boards With The Following Parameters A The Subject Of The Proceedings Is 1 Piece Of The Said Machine B The Machine Is Brand New And Unused C Warehouse With An Area Of 11 00 12 00 M X 21 00 25 00 M D Intended For Panels Raw And Laminated Chipboard Raw And Laminated Mdf Board Raw And Laminated Hdf Board Lacquered Compact Disc Hpl Osb3 Board Ground Plywood Laminate Sheets E Dimensions Of Supported Boards Length No More Than 2 000 Mm To Not Less Than 4 200 Mm Width No More Than 600 Mm To Not Less Than 2 100 Mm Thickness From 3 Mm Minimum F Maximum Weight Of The Board Maximum Lifting Capacity Min 200 Kg G Residual Plate Dimension Length 2000 4 200 Mm Width 600 2 100 Mm H Height Of The Stump 1 800 2 500 Mm Hall Height 3 600 Mm I Spacing Between The Stacks 120 Mm 180 Mm J A Cart With Min 9 Pcs Plate Suckers With A Lifting Capacity Of Min 200 Kg K Manipulator Unit Rotating By 90 L Mobile Speeds X Minimum 130 M Min Y Minimum 110 M Min Z Minimum 40 M Min M Mysql Database Or Equivalent Compatible And Linked To The Local Database Of The Employer N Software License For One Office Station O The Machine Should Be Safe For Use And Environment And Marked With The Ce Mark Panel Saw With A Pressure Beam With The Following Parameters Time Limit For Receipt Of Tenders Or Requests To Participate 21 1 2019 12 00 Disclaimer The Above Text Is Machine Translated For Accurate Information Kindly Refer The Original Document
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