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Tenders Are Invited For Xinlian Microelectronics Company Limited Bench Spm Clean Tool For Fe Loop Wafer(1) in China

Tender Notice

TenderID 120544000
Tender Brief Tenders Are Invited For Xinlian Microelectronics Company Limited Bench Spm Clean Tool For Fe Loop Wafer(1)
Competition Type ICB/NCB (Plz Refer Document)
Funded By Self-Funded
Country China
Tender Value Plz Refer Document
Tender Value In USD Plz Refer Document

Key Dates

Publish Date 12 Nov 2026
Last Date of Bid Submission 03 Dec 2026

CPVs

Other Detail

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