Tender Notice |
|
| TenderID | 117394222 |
| Tender Brief | Tenders Are Invited For Supply Through Framework Agreement For Hotmelt Smart Card Chip Bond Ribbon (According To Drm 45118030)Ref.: Pa/Am/1504/Tj/2026/Sp427257 |
| Competition Type | ICB/NCB (Plz Refer Document) |
| Funded By | Self-Funded |
| Country | Spain |
| Tender Value | EUR 154,000 |
| Tender Value In USD | 164,903 |
Key Dates |
|
| Last Date of Bid Submission | 18 Sep 2026 |
CPVs |
Other Detail |
|
| View Original Tender Notice / Tender Document |
