Tenders Are Invited For Machines And Apparatus With Individual Functions – Supply Of 12Μm Ultrasonic Wire Ca ... in France

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Machines And Apparatus With Individual Functions – Supply Of 12Μm Ultrasonic Wire Cable Machine. The Laip, Component Assembly And Integration Laboratory For Photonics, Carries Out Wire Cabling Steps For Its Functional Device Packaging Activities. The Current Evolution Of Performance And The Miniaturization Of Pad Sizes On Chips Leads Us To Supply A New Wire Cabling Machine Allowing Ultrasonic Welding To Be Carried Out With Wires Of 12Μm Versus 25Μm Standard On The Current Market. This Document Defines Our Needs For The Acquisition Of A New Machine. Overall, It Must Allow Cabling At A Minimum Of 12Μm But Also In 25 And 75Μm, From Chips To Boxes Or The Interconnection Of Chips Directly On A 200Mm Plate. The Equipment Must Also Allow Semi-Automatic Wiring Of Dimensional Wires.

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