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Tenders Are Invited For Electronic Integrated Circuits And Microassemblies – Supply Of An Integrated Advance ... in Spain

Tender Notice

TenderID 116439235
Tender Brief Tenders Are Invited For Electronic Integrated Circuits And Microassemblies – Supply Of An Integrated Advanced Instrumentation Platform For Characterization Of Photonic Devices For The Upv Pilot Line (Upv25, Upv26, Upv29, Upv30, Upv31 And Upv32)
Competition Type ICB/NCB (Plz Refer Document)
Funded By Self-Funded
Country Spain
Tender Value EUR 2,700,000
Tender Value In USD 2,891,160

Key Dates

Publish Date 31 Jul 2026
Last Date of Bid Submission 15 Sep 2026

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