Tender Notice |
|
| TenderID | 114552770 |
| Tender Brief | Tenders Are Invited For System For High Apect Ratio Etch Consisting Of Mainframe And Process Chambers (Ipms-Cnt05.1) |
| Competition Type | ICB/NCB (Plz Refer Document) |
| Funded By | Self-Funded |
| Country | Germany |
| Tender Value | Plz Refer Document |
| Tender Value In USD | Plz Refer Document |
Key Dates |
|
| Publish Date | 17 Jun 2026 |
| Last Date of Bid Submission | 15 Jul 2026 |
CPVs |
|
| 42990000-Miscellaneous special-purpose machinery | |
Other Detail |
|
| View Original Tender Notice / Tender Document |
