Mass Spectrometer – Tof-Sims 2026. The System Is Used As A Central Analysis Platform For High-Resolution Chemical Surface Characterization, Imaging Analysis (2D Imaging) As Well As Depth Profiling And 3D Reconstruction. It Serves Scientific And Application-Related Questions In Industrial And University Research As Well As Contract Research And Is Used In Cooperation Projects With Industrial Partners And Research Institutions. Samples With Widely Varying Properties Are Examined At The Institute. These Differ In Particular With Regard To Material Classes (E.G. Metals And Alloys, Semiconductors, Glasses, Ceramics, Polymers), Geometry, Surface Condition, Contamination And Layer Systems As Well As Analytical Questions. A Particular Focus Is On The Analysis Of Surfaces And Layer Systems, Including The Identification Of Complex Species And The Quantitative/Comparative Evaluation Of Signals Across Series Of Measurements. To Ensure Reproducible And Traceable Results, The System Must Provide Stable Uhv Operation, High Mass Resolution/Mass Accuracy, High Lateral Resolution For Imaging Methods, And Controlled Material Removal For Depth Profiles. In Addition, Structured Capture And Exportability Of Measurement Data And Metadata In Common, Non-Proprietary Formats Is Required In Order To Meet Requirements For Traceability, Long-Term Availability And Research Data Management (Fair Principles). The System Must Include At Least The Following Components/Functions (Function-Oriented; Implementation Permitted Regardless Of Manufacturer, Provided Requirements Are Met): - Uhv Analysis Chamber (Recipient) For Optimized Vacuum Conditions Including Sample Lock, Suitable Sample Handling And Observation Option In The Analysis Position (Camera/Optics Or Functionally Equivalent). - Tof Mass Spectrometer Including Ms/Ms Functionality (Tandem Ms) Or Functionally Equivalent Solution For Improved Identification/Structure Elucidation. - Analysis Ion Source (E.G. Bi-Lmig-Based Or Functionally Equivalent) For High-Resolution Imaging Sims Analysis. - Sputter Ion Source(S) For Controlled Material Removal/Depth Profiling (E.G. Cs And O2/Ar Ion Gun Or Functionally Equivalent) With Stable Current Output Over Long Measurement Times. - Cluster Ion Source (E.G. Ar Cluster, Possibly O2 Cluster Or Functionally Equivalent), Including Option For Analysis/Imaging Use, If Required. - Fib Function For Cutting And Tomography In The Analysis Position Using Additional Lmig Source - Charge Compensation (Electron Flood Gun Or Functionally Equivalent). - Basic Sample Holder Equipment Including Mounting Material As Well As Defined Options For Holding Large Samples (Especially Wafers Up To 300 Mm). - Gas Installations/Supply For The Sources Integrated In The System (Working Gases) Including The Necessary Safety Components. - Ste
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