Request For Quotation Purchase Of Computer Hardware And 3D Equipment For The Uav Laboratory in Kazakhstan

Work Detail

1. General Characteristics Of The Device Device Type: Hybrid Intelligent System (3D Printing/Laser Cutting). Design: Completely Closed Thermostable Chamber. Dimensions (Wxdxh): At Least 492 × 514 × 626 Mm. Net Weight: Not Less Than 31 Kg. Display: Color Touch Screen With Intuitive Interface. Camera: Built-In Ai Camera For Remote Monitoring. 2. Laser Module (High-Power 40W) Laser Type: High-Density Diode Laser. Output Optical Power: At Least 40 W. Cutting Working Area: At Least 300 × 285 Mm. Functions: Laser Cutting, Deep Engraving, Drawing. Safety: Air Filtration System And Safety Glass. Capabilities: Cutting Wood (Up To 15-20 Mm), Acrylic, Leather, Metal. 3. 3D Printing Parameters Technology: Fdm (Fused Deposition Modeling). Printing Area: At Least 300 × 300 × 300 Mm. Number Of Extruders: At Least 2 (Direct Drive). Nozzle Temperature: Up To 350°C (Supports Refractory Plastics). Maximum Speed: Up To 1000 Mm/S. Acceleration: Not Less Than 20,000 Mm/S². 4. Intelligent Functions And Calibration Ams 2 Pro System: Automatic Feeding And Drying Module For Materials. Calibration: Automatic Alignment With 140+ Points. Ai Control: “Pasta” Detection, First Layer Control, Vibration Damping. Drawing Function: Support Tools With Diameter 10.5-12.5Mm.5. Interfaces And Software Communications: Wi-Fi (2.4/5 Ghz), Bluetooth, Usb Port. Software: Branded Slicer With Support For Laser Modes. Cloud Functions: Control Via Mobile Application. Complete Set (Full Combo) Device: Base Unit. Laser: Replaceable Module 40W With Focusing System. Feed: Ams 2 Pro System (4 Slots). Materials: 4 Spools Of Pla+ (Black, 4 Kg), 2 Spools Of Pla+ (Red, 1 Kg). Accessories: Cable Set, Replacement Nozzles, Safety Glasses, Instructions. Warranty: Official Warranty 12 Months, 1. Central Processing Unit (Cpu) Architecture: X86-64, High Performance Series (Index H) Number Of Cores: No Less Than 8 Number Of Threads: No Less Than 12 Clock Frequency: In Turbo/Boost Mode ≥ 4.4 Ghz L3 Cache: No Less Than 12 Mb 2. Graphics Subsystem (Gpu) Type: Discrete Graphics Adapter Video Memory: No Less Than 6 Gb Gddr6 (Optimally 8 Gb) Technologies: Hardware Support For Ray Tracing (Ray Tracing) And Tensor Cores For Ai Acceleration (Dlss 3.0 And Higher) Power (Tgp): At Least 75–95 W3. Random Access Memory (Ram) Volume: At Least 16 Gb (Installation 2×8 Gb) Type: Ddr4 Or Ddr5, Frequency ≥ 3200 Mhz Expandability: Availability Of Free Slots For Upgrade In The Future 4. Storage Type: Ssd (Nvme Pcie) Volume: At Least 512 Gb5. Display Diagonal: At Least 15.6 - 16 Matrix Type: Ips Resolution: At Least Full Hd (1920×1080) Refresh Rate: At Least 144 Hz 6. Cooling System Type: Active, At Least 2 Fans And Copper Heat Pipes Design: Separate Heat Dissipation From The Cpu And Gpu7. Interfaces And Communications Ports: At Least 3 Usb Ports, Usb-C And Hdmi Are Required Network: Wi-Fi 6, Bluetooth 5.18. Operating System Type: Pre-Installed Licensed Os (Current Version) 9. Contents And Warranty Warranty: At Least 12 Months Contents: Laptop, Power Supply, Cable, Technical Specifications 1. Central Processing Unit (Cpu) Architecture: X86-64 Number Of Cores: No Less Than 6 Number Of Threads: No Less Than 12 Clock Frequency: Base ≥ 2.5 Ghz, Turbo/Boost Mode ≥ 4.4 Ghz L3 Cache: No Less Than 12 Mb 2. Processor System Cooling Type: Active (Heatsink With Fan) Design: Tower Type With Heat Pipes Power Dissipation (Tdp): No Less Than 130 W Noise Level: No More Than 28 Db At Average Load 3. Video Card Type: Discrete Video Memory Capacity: No Less Than 8 Gb Gddr6 Technologies: Hardware Support For Ray Tracing, Tensor Cores And Frame Generation Technologies (Dlss 3.0 And Higher) Memory Bus: No Less 128 Bit Energy Efficiency: Low Heat Generation With High Performance 4. Random Access Memory (Ram) Capacity: 16 Gb (2X8 Gb Installation) Type: Ddr4, Frequency ≥ 3200 Mhz Expansion: Upgradeable To 32 Gb (Available Free Slots Or Replacing Modules) 5. Storage Type: Ssd (Nvme Interface) Volume: At Least 512 Gb6. Motherboard Chipset: Mid-Segment With Support For The Current Generation Of Processor And Pcie 4.0 Bus Interfaces: M.2 Nvme Slot, At Least 2 Slots For Ram7. Power Supply Power: No Less Than 550 W Certificate: No Less Than 80+ Bronze8. Case Type: Mid Tower Case Cooling: At Least 2 Pre-Installed Fans (In/Out) 9. Monitor Diagonal: At Least 27 Matrix Type: Ips Resolution: At Least Full Hd (1920×1080) Refresh Rate: At Least 75 Hz Features: Presence Of Eye Protection Technologies (Low Blue Light / Flicker-Free) 10. Operating System Type: Pre-Installed, Licensed Version: Not Lower Than The 64-Bit Version Of The Current Generation (Pro Version Recommended) Condition: Official Activation And Installed Drivers For All Components 11. Peripherals And Equipment Keyboard And Mouse: Wired Usb (Mouse With Resolution ≥ 1600 Dpi) Cables: A Full Set Of Power Cables And An Interface Cable For The Monitor Warranty: At Least 12 Months For The Entire Set

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