Bids Are Invited For Equipment & Machineries To Be Procured For Setting-Up Of Semiconductor Coe Lab Of Iti S ... in India

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Bids Are Invited For Equipment & Machineries To Be Procured For Setting-Up Of Semiconductor Coe Lab Of Iti Shahdara Total Quantity : 1; 1 CLEAN ROOM FACILITY TRAINING SYSTEM WORKBENCH • The working table should be made of a Stainless Steel Sheet • Dim: L x D x H - 3feet x 2feet x 2feet • Front door is made out of thick transparent UV Resistant plexiglass. • Air drawn through pre-filter is made to pass through highly effective HEPA filters • Main filter: HEPA Filter made from water- resistant, fire retardant, with a good efficiency rating. These filters are designed to accommodate higher air flow volume. • Prefilter: Prefilter is made from Non-Woven Synthetic with HDPE mesh and Al expanded mesh on  These filters can be cleaned by compressed air • Illumination: Fluorescent Lamp 40W • Sterilizing: UV Germicidal Tube  Training system should be covered with sensors (Temperature, Air quality, etc. for monitoring internal & external environment difference to explain the clean room facility. • Supply Voltage & Frequency: AC 230V, 50/60 Hz 1 Set 2 BASIC SEMICONDUCTOR DESIGN SIMULATION WITH HARDWARE WORKBENCH Structure of workbench should be made up of 1.5 mm thick CRC epoxy coated pipes Set up should be provided with workbench with following specifications: The basic structure should be made of 38x38x1.5mm, CRC epoxy coated pipes and top made up of good quality 19 mm thick plywood. Dimension (LxWxH): 4x2.5x2.5 (ft.) approx. With MS drawers 03 numbers, Two Pole MCB (16A–Havells/ Siemens) for safety. Workbench should have antistatic mat, caster wheels and multiple electrical sockets. The setup should be provided with workbench having following specifications: CMOS Simulation (Perpetual License) - 5 users A tool must support the following: Nanosheet field effect transistor (NSFET) with 3mm technology A schematic editor and support various digital models A Verilog description of schematic for layout generation. Facility to convert CMOS layout in schematic, compatible with DSCH, facility to convert MOSFET into FINFET structure Facility to Import/Export CIF layout from 3rd party layout tools FinFet device supports 2D cross section, 3D visualization, and layout construction It should have simulation of non-volatile memories such as EPROM, EEPROM and FLASH using double- gate MOS. documentation including several aspects of logic design It should support more than 200 basic circuits to be provided, which should be ready to simulate Hardware with configuration Intel i5 or higher, RAM 16GB DDR5/SSD 1TB, Win 11 Pro/24in Monitor/Keyboard + Mouse 3 SEMICONDUCTOR WAFER HANDLING TOOLS AND WEARABLES 1. Vacuum Wand-1no. vacuum wand set used for handling wafers, specifically for sizes ranging from 100mm to 200mm. It is available as a house-facilities setup and comes with accessories for safe and efficient wafer handling. 2. Stainless Steel Wafer Tweezer – 5 nos. of different sizes Stainless steel wafer tweezers are high-precision tools designed for handling fragile and delicate wafers, like those made from silicon or gallium arsenide 3. Diamond Tip Scriber–1 no. 4. Vacuum Pen-1 no 5. Gloves–15sets 6. Apron–15nos. 7. Carrying Case –1no. 1 Set 4 DIFFERENT TYPES OF WAFERS 5 NOS. EACH IN A CARRYING CASE 1. Extrinsic silicon wafer P type 2. Extrinsic silicon wafer N type 3. Extrinsic silicon wafer SiO2 coated prefabricated wafer 1 Set 5 AN INTEGRATED WORKBENCH CONSISTING OF AN INSTRUMENT PANEL AND A WORKING TABLE SUITABLE FOR STUDENTS TO LEARN AND PERFORM VARIOUS EXPERIMENTS OF ELECTRICAL MACHINES & MEASUREMENTS. Measuring Instruments are fitted in the panel such that necessary interfaces are easily accessible to user. Structure of workbench made up of 1.5 mm thick CRC powder coated pipes with top made up of good quality 19 mm thick plywood and covered with 1.8 mm off-white colour mica. The bench working area is covered by 2 mm thick antistatic mat which help students to controls static discharge as static cause interference or damage to students, equipment and circuitry. Workbench Structure Specifications: 1. The basic structure is made up of 38 x 38 x 1.5 mm CRC powder coated pipes for sturdiness. 2. Total Height of workbench = 1650 mm 3. MS drawers 03 numbers with lock It should have following Technical Specifications: 1. Soldering & De-soldering Station: 1set Soldering: Power consumption : 60 W Input voltage: 170 to 270 V Temperature range : 180 to 270 degree Centigrade De-soldering: Power Consumption: 70 watts Input: 170 to 270 Volt Temp range: 180 to 480°C Pump: diaphragm type for SMD rework Power consumption: 270 W Air pump: Diaphragm pump Hot air temperature: 200 to 550°C 2. SMD Technology Kit – 1no. SMD component identification board with SMD Components, Resistors, Capacitors, Inductors, Diodes, Transistors & and IC packages of assorted values. Proto boards with readymade solder pads for various SMD Components. SMD Soldering Jig. a. SMD Identification Board 1 no. b. Proto BOARDS 2 no’s each c. Discrete Surface Mount d. SOP e. SO f. Through Holes g. Chip Scale h. SMD Soldering Jig: 1 no. i. SMD Soldering Iron: 1 no. j. SMD components Resistors, Capacitors, Diodes, Transistors: 10nos. each k. Tweezers: 2nos., Manual: 1no 3.Soldering Smoke / Fume absorber – 1 no. Should be Ideal for use with Soldering Bench Top Work Station, Activated Carbon Filter, the filter shall be made of foam and activated carbon, ideal for absorbing toxins, Powerful fan to extract/absorb using extractor fan, Fan should have adjustable arm and flexible table clamp, absorbing angle, ESD safe, Low noise/quiet fan. 4. Electrical Outputs – 1no. A MS Panel strip below the shelf for housing Five 230V, 50Hz, Ac Main Electrical Sockets and Switches for use of Electronic equipment’s. 5. Safety Circuit Breaker – 1 no. Two Pole MCB (16A), Mains Supply - 230V AC 6. Digital Multimeter – 1 no. Features • 4*1⁄2 Large digital LCD Display • 20,000 Counts • Auto Power OFF • Data Hold • Backlight Technical Specifications DCV – 200mV/2V/20V/200V/1000V ACV – 200mV/2V/20V/200V/750V DCA – 20mA/200mA/2A/20A ACA – 200mA/2A/20A Resistance – 200W/2KW/20KW/200KW/2MW/20MW Frequency – 20kHz/200kHz Capacitance – 20nF/2mF/200mF 7. Bench top LCR Meter (Indicated are minimum required specifications)–1 no. Test Parameter: L-Q, C-D, R-Q, Z-Q, Z-D, Test Signal Frequency 100Hz,120Hz,1kHz, LCD Display, 8. Soldering Magnifier Assistant Lamp–1 no. Bench Type Magnifying Glass with illuminated white lighting Type: Illuminated Magnifier, Table Top Magnification: 10x or better. Lens Material: Glass Illumination: LED, Minimum 40 piece Operating Voltage:230V, 50Hz, AC Mains 9. Test Point Microscope with USB Camera – 1no. Microscope Camera: 1xPower supply, 1xUSB line,1Xhdmi line, 1xSoftware, 1x Remote Control, 1x15inch LCD Screen Definition: FULL HD Zoom: Digital Zoom HDMI interface- Standard HDMI output (Type A) USB interface -Standard USB 2.0 6 DIE BONDER • Working table should be made of Stainless Steel Sheet (size: as per lab requirement) • Front door is made out of thick transparent UV Resistant plexiglass. • Air drawn through pre-filter is made to pass through highly effective HEPA filters • Main filter: HEPA Filter made from water- resistant, fire retardant, with a good efficiency rating. These filters are designed to accommodate higher air flow volume. • Prefilter: Prefilter is made from Non-Woven Synthetic with HDPE mesh and Al expanded mesh on  These filters can be cleaned by compressed air • Illumination: Fluorescent Lamp 40W • Sterilizing: UV Germicidal Tube Motorized Z-Axis + Die Placement with Precise Movements + Epoxy Stamping + Rotation Head for Quick Tool Change + True Vertical Movement + Integrated Vacuum Pump + Rotatable Table + 6.5” TFT Touch Screen + Bond Arm Length 165mm + 100 Program Storage Capacities + Semiautomatic and Manual Mode Method: Epoxy Stamping–Die Placement Die Size: min. 100 × 100 µm max. 10 × 10 mm 1 Set Bond Time: 1 – 10.000 ms [1 – 20.000 sec optional] Bond Force: 10 – 150 cN [350 cN optional] Tool: 1,58 Ø 19 mm Motorized Z-Way: 17 mm [0,67"] 1 µm incremental steps Bond Arm Length: 165 mm [6,7"] X-Y Manipulator: 10 mm [0,4"] Parallelogram: 6:1 Temperature Control: up to 250°C +/- 1°C Power Supply: 100 – 240V +/- 10% 50/60 Hz 10A max. 7 SEMICONDUCTOR MATERIAL STUDY WORKBENCH Workbench should be made up of 1.5 mm thick CRC epoxy coated pipes Set up should be provided with workbench with following specifications; The basic structure should be made of 38x38x1.5mm CRC epoxy coated pipes and top made up of good quality 19 mm thick plywood with MS drawers 03 numbers with handle, lock & key Two Pole MCB (16A– Havells/Siemens) for safety. Workbench should have antistatic mat, caster wheels and multiple electrical sockets. The setup should be provided with workbench having following specifications: 1. Semiconductor Four probe Band Gap measurement Apparatus – 1no. Four Probes Contacts: Spring loaded Space between Probes: 2 mm ±2% Probes: Collinear Sample Material: Germanium crystal Oven Maximum Temperature: Ambient to 150 °C Heater Resistance: 45Ω Heater Voltage: 50V AC Temperature Sensor: LM35 (0 to 150 °C) Measurement Unit Display: LCD 16 x 2 characters Measuring Parameter: Current, voltage, temperature simultaneously Constant Current Generator Current Range: 0 to 15mA (approx.) Resolution: 1mA Open Circuit Voltage: 18V Probes are mounted on a Teflon bush, which ensures good electrical insulation PC Interfacing using USB/RS232 ports and supporting software 2. Semiconductor behavior in magnetic field-hall effect – 1 no. 1) Gauss and Tesla meter Microcontroller Based LCD Display for Measurement of Magnetic Field in Gauss and Tesla, With PC Interface facility. Sensor: Inas for better sensitivity Range : 0-20kG Special feature: Indicate the direction of the magnetic field magnetic field Mains: 230V AC ±10%, 50Hz PC interface: RS232 2) Measurement unit Probe current: 20mA (maximum) 1 Set Heater current: 0-700mA Temperature: 0-100°C Hall voltage: 200mV (maximum) Mains: 230V AC ±10%, 50Hz PC Interfacing using USB/RS232 ports and supporting software A) Hall probe Crystal: p-type lightly doped Resistivity: As on probe Thickness: As on probe B) Temperature Sensor: Temperature should be measured with PT-100 3) Constant Current Power Supply Current range : 0 to 3.5A Output voltage: 20V Display : LCD, 16 x 2 Mains: 230V AC ±10%, 50Hz 4) Electromagnet Poles: 25mm diameter Coils:2 Nos. Resistance: 5Ω (approximate) Input current: 3.5A at 20V Weight: 16kg 3. Semiconductor Energy band gap apparatus for diode - 1 no. DC Power Supply: +15V, 2.5A +6V, 2.6 A Diode : P-N junction germanium type PC Interfacing using USB/RS232 ports and supporting software Switch: 1 Pole, 2 Way Display : 16 x 2 LCD Measurement Voltage: 0 to 15V Current: 0 to 50µA (approximate) Temperature: 0 to 60°C Oven Height: 77mm, Width: 74mm Coil: Nichrome Wire Fuse: 0.5A 5. Hardware with configuration – 1 no. Intel i5 or higher RAM 16GB DDR5/SSD 1TB, Win 11Pro/24in , Monitor/Keyboard+ Mouse or Higher 8 DICING MACHINE Voltage: AC 220V Power: 275W Motor: 1/2 HP high torque DC motor with 0 - 3000 RPM Effective Dicing Range Dicing Area: X-axis: 8", Y-axis: 8" Dicing Depth: depended on cutting blade diameter: 4" Blade's Max. dicing depth<=2 mm 6" Blade's Max. dicing depth<=20 mm If sample area <= 2"x 2", the cutting depth can reach max. 2" by 6" blade and suitable flange Rotation: 180° by the motor (rotate speed / degree programmable)a dicing saw, designed for dicing and cutting almost all kinds of silicon wafers up to 8" diameter wafer or 8" LxW: 8"x1" components. It should be programmable by hardware with position accuracy of 0.01 mm in X, Y, Z, R four dimensions and the sample stage may be rotated Moving / Cutting Speed Range 1 Set X-axis: 1-50mm/min adjustable Y-axis: 1-50mm/min adjustable Z-axis: 1-20mm/min adjustable Rotation Speed Range Max. 120°/min Accuracy 0.0025 mm moving resolution and +/- 0.01 mm position accuracy. Working table should be made of Stainless Steel Sheet • Front door is made out of thick transparent UV Resistant plexiglass. • Air drawn through pre-filter is made to pass through highly effective HEPA filters • Main filter: HEPA Filter made from water-resistant, fire retardant, with a good efficiency rating. These filters are designed to accommodate higher air flow volume. • Prefilter: Prefilter is made from Non-Woven Synthetic with HDPE mesh and Al expanded mesh on • These filters can be cleaned by compressed air Illumination: Fluorescent Lamp 40W • Sterilizing: UV Germicidal Tube • Training system should be covered with sensors (Temperature, Air quality, etc. for monitoring internal & external environment differences to explain the clean room facility. • Supply Voltage & Frequency: AC 230V, 50/60 Hz 9 CPLD AND FPGA DEVELOPMENT PLATFORM Onboard input-output, ADC, DAC Memory, Displays, keyboard & peripherals 16-bit logic I/O, 8-bit ADC & DAC interface, 3 ½ digits seven segment display, LCD Interface, push buttons, hex keypads, switches FPGA Daughter Card specifications: Xilinx Family: Spartan 3, Device density: 400k gates, On board: 8 MHz crystal, Master reset Key: For hardware reset. Configuration Method: JTAG CPLD Card: Device density: 2400 gates, 108 macro cells, 8 MHz crystal, JTAG interface (boundary scan) 1 Set 10 DIODE CHARACTERISTICS TRAINER Diode characteristics trainer should have +12V DC Power supply. 3½ digit 1μA to 200mA Ammeter. 3½ digit 1mV to 200V Voltmeter. Different test points should be provided. Silicon, Zener and Light Emitting Diode (LED) should be provided. It should be able to perform Forward and reverse characteristics experiments. 1 Set 11 UNDERSTANDING INTERNAL ARCHITECTURE OF TRANSISTOR USING DIODES DC Power Supply: Fixed: +5 V, -5 V, +12 V & -12 V Variable: +1.2 to +10 V & -1.2 to -10 V Transistor: BC547 & BC557 Ammeter: Range: 1µA to 200ma Display: 3½ digits Voltmeter: Range: 1mV to 200 V Display: 3½ digits 2 Sets Mains Supply: 230 V AC ±10% Provided with Data acquisition facility:- Analog Inputs: 4 Inputs with 10-bit resolution Analog Output :2 Output 10-bit resolution Digital Inputs: 11 TTL Inputs Digital Outputs: 11 TTL Outputs Unity gain amplifier: 2 (0 to 10) Counter: 0 to 6 MHz (square wave) Power Supply: 12VDC 12 UNDERSTANDING INTERNAL ARCHITECTURE OF IC USING TRANSISTORS Fixed DC Power Supply DC Output Voltage (Fixed): +12V, -12V, +5V, - 5V Current (Max.): 200mA Ripple:<2 mVrms Power Supply : 230 V ±10%, 50 / 60 Hz Provided with Data acquisition facility: - Analog Inputs: 4 Inputs with 10-bit resolution Analog Output :2 Output 10-bit resolution Digital Inputs : 11 TTL Inputs Digital Outputs: 11 TTL Outputs Unity gain amplifier: 2 (0 to 10) Counter: 0 to 6 MHz (square wave) Power Supply: 12VDC. 2 Sets 13 POWER ELECTRONICS LAB Size of Breadboard: 172.5 mm × 128.5 mm DC Power Supply: +5 V, -5 V 500 mA, +12V, -12 V 500 mA, +15 V, 250 mA, +35V, -35V, 250 mA AC Power Supply: 18V0V-18V, 0V-15V On board Firing Circuits Frequency range: 30Hz to 900Hz variable Amplitude: 12V PWM control of G1, G2, G3 and G4 Duty cycle control of Gate” Signal is 0 to 100% SCR Assembly: 4 SCRs 2P4M, 400V/2A Power Devices: IGBT-G4BC20S, MOSFET- IRFZ44N, UJT-2N2646, DIAC- DB3, TRIAC-BT136, PUT- 2N6027 Pulse transformer on board: 2 nos. PT4502 1:1 and one is PT4503 1:1:1 Circuit Components on board: Electrolytic Capacitor 1uF, 63V Metalized Capacitor 0.1uF, 63V, Metalized Capacitor 0.33uF, 63V Diode 1N4007, Inductor 68mH, Inductor 68mH, Inductor 10mH Load selector: 6 load resistances- 47E/7W, 120E/5W, 270E/5W, 2K2/2W, 1K/1W, 1K/10W Test points:10nos Power Supply (Mains): 220V/110V, 50Hz/60Hz Included Accessories: Bread boards: 2 nos. Connecting wires: 20 nos. 2mm to 1mm Patch cords: 15 nos. 2mm Patch cords (Red) 16”: 4 nos. 2mm Patch cords (Black)16’’: 4 nos. 2mm Patch cords (Blue) 16’: 12 nos. Mains cord: 1 no 2 Sets 14 TEST AND MEASUREMENT WORKBENCH Structure of workbench should be made up of 1.5 mm thick CRC epoxy coated pipes Set up should be provided with workbench with following specifications: The basic structure should be made of 38x38x1.5 mm CRC epoxy coated pipes and top made up of good quality 19 mm thick plywood with MS drawers 03 numbers, Two Pole MCB (16A–Havells/ Siemens) for safety. Workbench should have antistatic mat, caster wheels and multiple electrical sockets. The setup should be provided with workbench having following specifications: 1. DC Regulated Variable Programmable DC Power Supply – 1 no. 0-30V/3A with numeric keypad, PC interface and LCD for Voltage, Current & Power 2. 100 MHz Mixed Signal Oscilloscope (4 Analog + 16 Digital Channel) – 1 no. 100MHz Mixed Signal Oscilloscope (4 Analog + 16 Digital Channel) with 1.25GSa/s real time sampling rate, 12bit vertical resolution, 200μV/Div to 10V/div vertical sensitivity, 50Mpts Memory depth, 1,000,000 wfms/s waveform capture rate and 7-inch multi touch display. Component tester should be provided. 3. 50 MHz Arbitrary Waveform Generator with Digital Display for Frequency and Amplitude–1 no. 50MHz, 2 Channel Arbitrary Function Generator with 625 MSa/s sample rate, 16-bit vertical resolution, 7 Digit 240MHz frequency counter, min 150 built in waveform, 2 Mpts record length, min 8 th order harmonic generator and 4.3-inch touch screen display. Standard Waveform Sine, Square, Ramp, Pulse, Noise, Arb, Harmonic, 148 types of waveforms, including Sinc, Exponential Rise, Exponential Fall, ECG, Gaussian, Haversine, and Lorentz Built-in Arb Waveform, Frequency Range: Waveform: Sine (1 μHz to 50 MHz), Square (1 μHz to 40 MHz), Ramp (1 μHz to 1 MHz),Pulse (1 μHz to 25 MHz), Amplitude Range (into 50 Ω): 1 mVpp to 10 Vpp, 16-bit resolution Modulation: AM, FM, PM, ASK, FSK, PSK, PWM, SUM, 7-inch touch screen Display, USB and LAN interfaces for remote connection, Type-C power interface for powering the instrument with mobile power source 4. 5½ Digit Digital Multimeter – 1 no. 5.5 Digit DMM with 2,200,000 counts, 200mV to 1000V (DC); 200mV to 750V (AC) voltage range, 200uA to 10A (AC/DC) current range, any sensor measurement using software, max measuring speed 10 K rdgs/s, Real time trend display and histogram display function, standard interface like USB Device, USB Host, LAN 1 Set 15 ELECTRICITY SAFETY TRAINER Demonstration of t h e importance of earthing in any electrical device arrangement to study the role of fuse and types of slow blow, high blow fuse in any electronic circuit. Arrangement to study the importance of MCB and its Working.  It should be provided with simulated P,N,E Terminals along with load & shoe for fault demonstration.  Earthing simulation with Current flow path demonstration using LEDS  Performing different electrical activities to avoid electrical hazards.  Glass Fuse destructive Test – Slow Blow and Fast blow  Real time appearance of MCB to help the students to understand its mechanical arrangement. Technical specifications Earth Safety Section: No. of LEDs: 18 nos. Fuse Section: No. of Fuse: 40 nos. Fuse Rating: 100mA, 0.1A, 5A Toggle switch : On –Off type MCB Section: MCB Rating: 2A (open type) Ammeter: 5A Potentiometer:230V, 5A Single phase socket : 5A Load : 1200W Connecting Leads: 8 nos. 2 Sets 16 ESD SYSTEM Static Discharge stand should be used to discharge the static charge of Human Body. Plates with Maximum surface Wall Plate (approx.):300mm(L)x600mm(W)x3mm(H) Foot Plate (approx.):420mm(L)x220mm(W) Low battery Indication Electrostatic Discharge (ESD) Tester Battery: 9 Volt Battery Indication: Visual by different color LED’s Digital 2 Sets 17 EMI SOLUTION FOR SEMICONDUCTOR DEVICES Low-frequency magnetic field1Unit (µT) Measuring range Resolution Accuracy 20/-...200.0 µT 0.01µT, 0.1 µT ±12% + 5 digits at50/60 Hz Unit (mG) Measuring range Resolution Accuracy 200.0... 2000 mG 0.1mG, 1 mG ±12% + 5 digits at50/60 Hz Low frequency electromagnetic field Unit V/m Measuring range Resolution Accuracy 50V/ m ... 2000V / m 1V/ m ±7% + 20 digits at50/60 Hz High frequency electromagnetic field Unit mV / m, V /m Measuring range Resolution Accuracy 30.0mV / m ... 11/-V / m 0.01,0.1 mV / m 1.0dB at 1V / m 0.01V/ m and900 MHz, >1V / m should only use for reference Unit µW / cm² Measuring range Resolution 0.02... 32.0 µW / cm² 0.01,0.1 µW / cm² Unit µW / m², mW /m² Measuring range Resolution 2.3µW / m² 320.9 µW / m² 0.1,1 µW / m² 0.1mW / m² Unit mA / m Measuring range Resolution 0.07.29.1-mA / m 0.01,0.1-mA / m Bandwidth High frequency: 50 MHz ... 3.5GHz Low frequency: 50/60Hz Number of sensors: Magnetic field: 3, Electromagnetic field:1 Measuring rate1Hz 2 Sets 18 SEMICONDUCTOR 5 DIFFERENT WALLCHART PRINTED WITH ACRYLIC FRAMES 2FT. X 3FT. 1 each 19 PCB DESIGN AND DEVELOPMENT WORK BENCH Structure of workbench should be made up of 1.5 mm thick CRC epoxy coated pipes Set up should be provided withworkbench with following specifications: The basic structure should be made of 38x38x1.5mm CRC epoxy coated pipes and top made up of good-quality 19 mm thick plywood with MS drawers 03 numbers, Two Pole MCB (16A – Havells/ Siemens) for safety. Workbench should have antistatic mat, caster wheels and multiple electrical sockets. The setup should be provided with workbench having following specifications: Working area (XxYxZ) : 230x200x15mm Minimum drill hole size: 0.3 mm Minimum cutting trace/space: 0.2mm (8mil) X/Y resolution : 0.006 mm Spindle speed (MAX. RPM): 25000 rpm Spindle Motor: BLDC motor depth sensing and adjustment: Automatic, Software controlled Tool change: Manual Tool holder:1/8 inch Auto level / surface inspection: available Working bed: Cast Aluminum Imports files: Gerber RS-247X files: Excellon Drill DXF and G code files X/Y/Z driver: Stepping motor Power consumption: 110/220VAC, 150W Sound/dust enclosure: Integrated Operating System: Windows 10 (32/64 bit) Electronics Circuit Simulation (5 users) The software should have following features / Specifications: The software should have a circuit simulation and PCB design of analog, digital and mixed electronic circuits with their PCB layouts. It should have a library of at least 20 thousand components. It should support Spice, VHDL, Verilog, Verilog AMS and SystemC, Create Digital filters in SystemC and run in software, add MCUs in SystemC to the software. It should also have facility to analyse SMPS, RF, Communication, Power Electronics and Optoelectronic circuits. The software must be able to simulate PIC, AVR, 8051, ARM and Arduino MCUs, in digital or mixed circuit environment. It should have features to generate and debug MCU code using the integrated flow chart tool and test microcontroller applications in a mixed circuit environment. The software should have facility of fault creation in the components, automatic calculation of the component value for the optimization of designed circuit. It should support digital circuit simplification of digital logics and the implementation of logic gates using the QuineMccluskey method and Karnaugh-Map. The software should support. symbolic analysis: automatic creation of closed form expressions and for DC, AC and Transient analysis of linear circuits. The software must support ADCs, DACs with SPI, I2C, SPI bus simulation, PM bus, SM bus simulation. It should also provide facility to study two-port parameters of networks (S, Z, Y and H), DC Transfer Characteristic with Nested sweep option and Parameter Sweeping function to study the response of components. Functions to plot the frequency response, Phasor Diagram, Nyquist Diagram and Noise Analysis. Linux simulation on ARM MCU should be possible. Prerecorded (.wav) files can be used as input in circuits and transient analysis results can be converted to .wav files or played using the sound system of computers. All user perpetual license of the software should support either digital online access, and simulation or the license protection and have facility to upgrade in future. 1 Set PCB Design: Create Multilayer PCB layouts of circuits, with automatically placed and routed components. All components in software should be “PCBready” and have associated footprints which user can review and change on a component spreadsheet. It should also have 3D capability to preview the physical parts already on the schematic diagram with run time animation in 2D and 3D view, visualizations of PCB design with Enclosures in 3D, 3D printer support, Importing Footprints in 2D and 3D in industry standard formats. PCB design software should support both G code and Gerber generation of the data. Hardware with basic configuration Intel i5 or higher, RAM 16GB DDR5/SSD 1TB, Win 11 Pro/24in Monitor / Keyboard + Mouse 20 INDUSTRIAL SENSOR LAB Sensor Training Platform for PLC includes different type of Sensor modules like Photoelectric through beam sensor, Photoelectric retro reflective sensor with reflective plate, Reflective fiber coupled with Fiber sensor amplifier, Diffuse reflective sensor, Distance settable sensor, 8 pin din mounted 24VDC coil electromagnetic relay, Digital counter, Tachometer, Cylindrical capacitive sensor, Flat capacitive sensor, Cylindrical inductive sensor switch and Sensor module, Motorized module with speed controller sensors. Photoelectric through beam sensor: 1no. Sensing method : Through beam Maximum sensing distance:5 meter Control output : PNP, Operating voltage : 12 – 24VDC Photoelectric retro reflective sensor with reflective sensor: 1 no. Maximum sensing distance: 2 meter Control output: PNP Operating voltage: 10 – 30VDC Photoelectric retro reflective sensor with reflective sensor: 1 no. Maximum sensing distance : 2 meter Control output : PNP Operating voltage : 10 – 30VDC Diffuse reflective sensor: 1 no. Maximum sensing distance : 50-70cm (approx.) Control output : PNP Operating voltage: 10 – 30VDC Diffuse reflective sensor adjustable sensitivity: 1 no. Maximum sensing distance: 10-30cm (approx.) Control output: PNP Operating voltage: 10-30VDC Distance settable sensor: 1 no. Maximum sensing distance: 2mm–80mm (approx.) Control output: PNP Operating voltage: 10-30VDC Digital counter: 1 no. Display: Single display, 4 digit, 0.56’’, 7 segment, Red LED display Input: PNP sensor/ switch Range: 0-999999 count Supply: 230V AC Tachometer: 1 no. Range : 4-5000RPM Display : Single display, 4 digit, 0.56’’, 7 segment, red LED display Input: PNP sensor/ switch Switch and LED module: 1no. LED light: 3 nos. Momentary switch: 2 nos. Supply : 24VDC Motorized (24VDC) rotary disc: 1 no. (with 2 set of black and white region) 2 Sets Supply : 24VDC Motorized (24VDC) rotary disc: 1 no. (with 2 set of yellow, green, blue, and red region) Supply : 24VDC Cylindrical capacitive sensor: 1 no. Maximum sensing distance: 10 mm (approximately) Control output : PNP Operating voltage : 10-30VDC Flat capacitive sensor: 1 no. Maximum sensing distance : 8mm (approximately) Control output : PNP Operating voltage : 10-30VDC Cylindrical inductive sensor: 1 no. Maximum sensing distance : 8mm (approximately) Control output : PNP Operating voltage : 10 – 30VDC 8 pin din mounted 24VDC coil electromagnetic relay: 1 no. Coil voltage: 24VDC Type: DPDT Mains Supply : 110-220V ±10%, 50/60Hz 21 FURNITURE 21.1 INSTRUCTOR CHAIR Type of Chair-Revolving Chair of Adjustable height with Wheels Seat upholstery material - Mesh fabrics, Backrest Height (Low-back range: 200-400 mm, Midback range:400-700mm,High-back range: More than 700 mm-Mid Back Locking should be available while tilting the backrest. Minimum Chair Seat height- 400 mm, Minimum Height Adjustment Range of Seat- 150 mm 01 No. 21.2 INSTRUCTOR TABLE Table Top Material Type - Particle Board, Should be availability of Table Top Edge, Thickness of Table Top Edge (Tolerance ±5 mm) - 25 mm Table Top Edge- Straight, Length of Table Top- 1500 mm, Depth of Table Top- 750 mm 01 No. 21.3 TRAINEES CHAIR Chair Frame type- Legs, Frame Pipe / Legs Material- Mild Steel, Type of SeatWithout Cushion, Seat Material- Mild Steel, Backrest Material- Mild Steel, Backrest Type - Full Back 24 Nos.

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