Contract Award Notice |
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| TRR | 30438407 |
| Organization | Dept Of Defense |
| Tender No | N0017326P2436 |
| Funded By | Self-Funded |
| Country | United States , Northern America |
| Contract Value | 672,985 |
Work Detail |
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Contract Award For Semiconductor Die Bonding And Vacuum Packaging System |
Key Dates |
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| Contract Date | 14 Sep 2026 |
Contact Information |
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