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Contract Award For Silicon Carbide Laser Processing Equipment


Contract Award Notice

TRR 30380703
Organization CLP compound semiconductor co., LTD
Tender No 0664-2640SUMECF75
Funded By Self-Funded
Country China , Eastern Asia
Contract Value Plz Refer Document

Work Detail

Contract Award For Silicon carbide laser processing equipment

Key Dates

Contract Date 08 Sep 2026

Contact Information

Company Name Zhongwei Precision Microfab Instruments Co.Ltd.
Contract Value Plz Refer Document
Contract Date 08 Sep 2026

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