Contract Award Notice |
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| TRR | 29510380 |
| Organization | Shanghai Xinyuan Innovation Center |
| Tender No | 0705-264506026053 |
| Funded By | Self-Funded |
| Country | China , Eastern Asia |
| Contract Value | Plz Refer Document |
Work Detail |
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Contract Award For ICB for Wafer Deep Hole Cleaning Machine of Shanghai Xinyuan Innovation Center |
Key Dates |
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| Contract Date | 13 May 2026 |
Contact Information |
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