Subscribe     Pay Now

Contract Award For PCB Bond Inspection Machine


Contract Award Notice

TRR 29457075
Organization Tianma(Wuhu)?Microelectronics?Co.,?Ltd.
Tender No 0730-264010020002/27
Funded By Self-Funded
Country China , Eastern Asia
Contract Value Plz Refer Document

Work Detail

Contract Award For PCB bond inspection machine

Key Dates

Contract Date 07 May 2026

Contact Information

Company Name ShenZhenShi Hongfuhan Technology Co.LTD
Contract Value Plz Refer Document
Contract Date 07 May 2026

View Notice Now...

Login with your Social Account for Instant Access to this notice


Tell us about your Product / Services,
We will Find Tenders for you