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Contract Award For Nantong Kangyuan IC Packing Board Project (Phase I)-Ultrasonic Scanning...


Contract Award Notice

TRR 27813849
Organization Nantong Hong Yuen Circuit Technology Co., Ltd.
Tender No 0730-254012SZ0136/06
Funded By Self-Funded
Country China , Eastern Asia
Contract Value Plz Refer Document

Work Detail

Contract Award For Nantong Kangyuan IC Packing Board Project (Phase I)-Ultrasonic scanning microscope 1 set

Key Dates

Contract Date 02 Dec 2025

Contact Information

Company Name Shenzhen Nanotec Electronics Co. Ltd.
Contract Value Plz Refer Document
Contract Date 02 Dec 2025

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