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Contract Award For Nantong Kangyuan Integrated Circuit Packaging Substrate Project (Phase ...


Contract Award Notice

TRR 26708554
Organization Nantong Hong Yuen Circuit Technology Co., Ltd.
Tender No 0692-2540XM075362
Funded By Self-Funded
Country China , Eastern Asia
Contract Value Plz Refer Document

Work Detail

Contract Award For Nantong Kangyuan Integrated Circuit Packaging Substrate Project (Phase I)-CNC PCB Forming Machine 1 set

Key Dates

Contract Date 19 Sep 2025

Contact Information

Company Name run on eleclronic(hk)co.limited
Contract Value Plz Refer Document
Contract Date 19 Sep 2025

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