Tenders Are Invited For Microelectronic Machinery And Apparatus – Supply Of Chemical Mechanical Polishing Eq ...
Tender Notice
TenderID
79429257
Tender Brief
Tenders Are Invited For Microelectronic Machinery And Apparatus – Supply Of Chemical Mechanical Polishing Equipment With Integrated Cleaning And Drying Modules
Microelectronic Machinery And Apparatus – Supply Of Chemical Mechanical Polishing Equipment With Integrated Cleaning And Drying Modules. Cea-Leti Wishes To Acquire Chemical-Mechanical Polishing Equipment With Integrated Cleaning And Drying Modules. The Equipment Is Aimed At Feol And Meol Applications Without Cross-Metal Contamination. The Equipment Must Be Capable Of Performing Parallel Processing Of Batches Of Wafers With Different Levels Of Contamination. The Materials Involved In This Type Of Polishing Are Silicon, Silicon Oxide, Nitride, Tungsten And Other Metallic Materials. This Equipment Will Be Installed In The Cea Clean Room. It Is Intended To Process 200Mm Plates. It Must Be Able To Integrate A Metrology Module. This Contract Includes The Following Mandatory Options: - Option 1: Level 1 Maintenance Training, Page 36 Of The Specifications, - Option 2: Advanced Maintenance Training, Page 36 Of The Specifications. This Contract Includes The Following Optional Options: - Option 3: Supply Of Heat Exchangers And Cooling System, Page 16 Of The Specifications, - Option 4: Supply Of An Electrical Transformer, Page 23 Of The Specifications, - Option 5: The Price Of Transport, Insurance Included, According To The Dap Cea Grenoble Conditions (Incoterms Icc 2020 Convention).
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