Tenders Are Invited For Acquisition Of Mobile Phone Repair Equipment Kits Consistency Of The ServicesThis Call For Tender Consists Of The Acquisition Of 60 Mobile Phone Repair Kits Consisting Of 01 Set Of Micro Screw Spindle 10 Pieces 01 Digital Multimeter 01 Set Of Tweezers 01 Inclined Cutting Electronic Pliers 01 Electronic Nose Pliers Half Round Right And End 135Mm 01 Electronic Pliers Round Bent Angled 45 145Mm 01 Half Round Nose Pliers Insulated 3 Uses Cut Stripping Crimping 01 Universal Clamp 160 Mm Insulated 01 Insulated Cutting Pliers 160 Mm 01 Soldering Iron For Fine Work 50W 220Vmax 380 C 01 Soldering Iron 220V 120W Tip Diameter 8Mm 01 Tin Roller Diameter 1 5 And Roll 15G 01 Pot Of Paste To Solder 50G 01 Desoldering Pump 01 Braid To Desolder 01 Toolbox With 02 370X190x130 Mm Polypropylene Lockers 01 Security Locks 01 Support For Portable Wafer 01 Magnifying Lamp 01 Power Supply Box 01 Wafer Cleaning Pump 01 Atf Turbo Decoding Decoding Box 01 Disassembling Machine For Screen 01 Clip Cutter For Sim Card 01 Insufflator Provisional BondEach Tenderer Must Attach To His Administrative Documents A Bid Bond Established By A First Rate Financial Institution Approved By The Ministry Of Finance In The Amount Of Six Hundred Thousand Fcfa 600 000 And Valid For Thirty 30 Days Beyond The Original Date Of Validity Of The Offers Disclaimer The Above Text Is Machine Translated For Accurate Information Kindly Refer The Original Document
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We have received Tender Document request for the TDR No : 23110291
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