Tender Notice |
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TenderID | 21777372 |
Tender Brief | Tenders Are Invited For Design Build And Deploy A Survey Module In Tms In Centre For Advanced 2D Materials National University Of Singapore |
Competition Type | ICB/NCB (Plz Refer Document) |
Funded By | Self Funded |
Country | Singapore |
Tender Value | Plz Refer Document |
Tender Value In USD | Plz Refer Document |
Key Dates |
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Last Date of Bid Submission | 13 Dec 2019 |
Other Detail |
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View Original Tender Notice / Tender Document |