Tenders Are Invited For Design Build And Deploy A Survey Module In Tms In Centre For Advanced 2D Materials N ...

Tender Notice

TenderID 21777372
Tender Brief Tenders Are Invited For Design Build And Deploy A Survey Module In Tms In Centre For Advanced 2D Materials National University Of Singapore
Competition Type ICB/NCB (Plz Refer Document)
Funded By Self Funded
Country Singapore
Tender Value Plz Refer Document
Tender Value In USD Plz Refer Document

Key Dates

Last Date of Bid Submission 13 Dec 2019

Other Detail

View Original Tender Notice / Tender Document

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