Tenders Are Invited For Procurement Project Of Laser Chip And Silicon Based Photonic Chip Bonding System Of ...

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Project Name Procurement Project Of Laser Chip And Silicon Based Photonic Chip Bonding System Of Changchun Institute Of Optics Fine Mechanics And Physics Chinese Academy Of SciencesTenders Are Invited For At Present The Research On Silicon Based Hybrid Integrated Light Source Using Laser Chip And Silicon Based Photonic Chip Bonding System Has Become A Development Trend Of Luminescence Applications At Home And Abroad Mainly Used For High Precision Flip Chip Interconnection Coupling Process Of Optoelectronic Chip And Laser Chip It Is A Necessary Means For The Development Of New Semiconductor Laser Devices The Device Supports Cold Press Welding Reflow Soldering In Situ Reflow Fluxless Eutectic Bonding Thermocompression Bonding And Bond Bonding Of Various Types Of Chips The Bonding Medium Can Support Gold Gold Tin Indium Copper Ultraviolet Or Heat Curing Adhesives And Various Polymer Materials Etc And Can Realize Various Types Of Iii V Chips And Ii Vi Materials Chips With High Precision Indium Indium Several Functions Of Bump Alignment Pressure Welding And In Situ Reflow The Purchase Of Laser Chip And Silicon Based Photonic Chip Bonding System Is A Device For The Device Assembly Platform Under The Semiconductor Laser Discipline Enhancing The Precision Coupling And Packaging Capabilities Of These Platforms And Ensuring The Narrow Width Laser And Fiber Grating Of The Laboratory In The Outer Cavity Of The Planar Waveguide Grating Basic Innovation Research And Key Technological Breakthroughs In New Semiconductor Lasers And Amplifiers Such As Narrow Line Wide Lasers And High Power Semiconductor Optical Amplifiers Products List 1 Laser Chip And Silicon Based Photonic Chip Bonding SystemPlace Of Implementation Changchun City Jilin ProvinceBeginning Of Selling Bidding Documents 2019 07 26Ending Of Selling Bidding Documents 2019 08 02Price Of Bidding Documents 800 120 120Deadline For Submitting Bids Time Of Bid Opening Beijing Time 2019 08 16 09 00

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