Contract Notice Laboratory Optical And Precision Equipments Excl Glasses Precision Pick And Place Flip Chip Assembly System For ElabDescription The Physical Institute Would Like To Procure A Flip Chip Assembly System The System Must Be Fully Automated And It Must Be Suitable For High Precision Flip Chip Face Down And For Die Bonding Face Up Assembly The Equipment Must Be Suitable For Installation In A Clean Room Iso Class 7 It Will Be An Advantage If A Separate Service Unit If Required Is Located In An Adjoining Grey Room Time Limit For Receipt Of Tenders Or Requests To Participate Date 21 06 2019 Local Time 12 00
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