Tenders Are Invited For High Speed Digital Integrated Circuit Test System

Tender Notice
TenderID	18525866
Tender Brief	Tenders Are Invited For High Speed Digital Integrated Circuit Test System
Competition Type	ICB/NCB (Plz Refer Document)
Funded By	Self Funded
Country	China
Tender Value	Plz Refer Document
Tender Value In USD	Plz Refer Document

Key Dates
Last Date of Bid Submission	14 Feb 2019

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Tenders Are Invited For Xian University Of Electronic Science And Technology High Speed Digital Integrated Circuit Test System 2019002D Public Tender NoticeTime For Obtaining Bidding Documents 2019 01 24 08 30To2019 01 31 16 30Bidding Document Price 500Where To Obtain The Bidding Documents Tenders For The Conference Hall 10Th Floor Growth Building 58 West Section Of South Second Ring Road XianBid Time 2019 02 14 14 30Bid Opening Location Conference Room 10Th Floor Growth Building No 58 West Section Of South Second Ring Road XianBudget Amount 158 10 Million Rmb Disclaimer The Above Text Is Machine Translated For Accurate Information Kindly Refer The Original Document

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