Tenders Are Invited For 2D 3D Printer With Integrated Chip Attachment Capability

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Tenders Are Invited For 2D 3D Printer With Integrated Chip Attachment CapabilityEpfl Intends To Acquire A 2D 3D Printer With Integrated Chip Attachment Capability For Use As A Common Platform In Microcty Neuchatel Under The Guidance Of Strategic Focus Area Advanced Manufacturing Sfa Am The Equipment Will Be Devoted To The State Of The Art Research In Advanced Micro Production The Following Expected Tooling Capabilities Will Be At The Forefront Of Epfls Needs And The Specific Scientific Objectives Of Their Sfa Am 2D And 3D Printing Of A Variety Of Functional Materials Such As Conductors Insulators Semiconductors Elastomers Nanoparticulate Inks And Polymers With A 2D 3D Resolution Of 20 m Multi Layer Vision Based Alignment And Mechanical Precision Of 5 m Integrated Smd Silicon And Surface Mount Device Mounting For Direct Integration Of Electronic Components Into The Printed Part

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