Tender Notice |
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| TenderID | 66721151 |
| Tender Brief | Tenders Are Invited For R & D Development And Manufacture Of A Line Of Machines For One- And Two-Sided Grinding And Polishing Of Semiconductor Wafers, Code Tenderness |
| Competition Type | ICB/NCB (Plz Refer Document) |
| Funded By | Self-Funded |
| Country | Russia |
| Tender Value | RUB 1,775,000,000 |
| Tender Value In USD | 22,027,750 |
Key Dates |
|
| Publish Date | 30 Jun 2023 |
| Last Date of Bid Submission | 17 Jul 2023 |
CPVs |
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| 34400000-Motorcycles, bicycles and sidecars | |
Other Detail |
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| View Original Tender Notice / Tender Document |
