Tender Notice |
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TenderID | 58582924 |
Tender Brief | Tenders Are Invited For Semiconductor Wafer Bonding System |
Competition Type | ICB/NCB (Plz Refer Document) |
Funded By | Self-Funded |
Country | United States |
Tender Value | Plz Refer Document |
Tender Value In USD | Plz Refer Document |
Key Dates |
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Publish Date | 16 Dec 2022 |
Last Date of Bid Submission | 25 Dec 2022 |
CPVs |
Other Detail |
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View Original Tender Notice / Tender Document |