Tender Notice |
|
TenderID | 57463887 |
Tender Brief | Tenders Are Invited For Semiconductor Fabrication Of Wafers |
Competition Type | ICB/NCB (Plz Refer Document) |
Funded By | Self-Funded |
Country | United States |
Tender Value | Plz Refer Document |
Tender Value In USD | Plz Refer Document |
Key Dates |
|
Publish Date | 15 Nov 2022 |
Last Date of Bid Submission | 24 Nov 2022 |
CPVs |
Other Detail |
|
View Original Tender Notice / Tender Document |