Contract Notice Microelectronic Machinery And Apparatus115 Etching Equipment Chlorine Chemistry Fluorine ChemistryDescription The Cdpp Rie Icp Rie System To Be Procured Is A Dry Etching Unit Consisting Of 2 Modules With Separate Process Chambers A Rie Module Reactive Ion Etching Rie With A Parallel Plate Plasma Configuration And An Inductively Coupled Plasma Icp Module With Inductively Coupled Plasma Excitation The Rie Module Is Operated With Both A Chlorine And A Bromine Based Etching Chemistry The Primary Application Will Be The Structuring Of Metallization Levels In The Back End Of Line And The Structuring Of Silicon Waveguides In Silicon Pic Technology The Icp Rie Module Is Operated With A Fluorine Based Etching Chemistry The Primary Application Will Be The Structuring Of Dielectrics Sio2 And Sin In The Back End Of Line The Structuring Of Silicon Waveguides And The Fabrication Of Deep Topographies 25 m Depth In The Silicon Substrate In Silicon Pic Technology The Modules Are Installed Through The Wall D H The Loading Unloading Takes Place Via A Separate Vacuum Chamber Which Is Accessible From The Iso5 Clean Room Of The Cdpp While The Main Console The U A The Process Chamber Is Installed In The Iso7 Clean Room Of The Cdpp The Transfer Between These Chambers Takes Place Automatically A Special Evaluation Criterion Is The Future Expandability And The Optional Features Of The System Time Limit For Receipt Of Tenders Or Requests To Participate Date 24 05 2019 Local Time 12 00 Disclaimer The Above Text Is Machine Translated For Accurate Information Kindly Refer The Original Document
Contact Information
Other Detail
View Notice Now...
Fill Detail for Getting Instant Access
Download Tender Document / Tender Notice
Dear Sir,
Warm Greetings from TenderDetail.com !!
We have received Tender Document request for the TDR No : 19811443
Tender Notice along with it's Attachments ( Tender Document / Scan Image of News Paper)
sent to your Email Address :.
Please check your email for Tender Document.